The Logic & Architecture
A study in disaggregated tiles versus uniform chiplets. One prioritizes area efficiency by removing Hyper-threading; the other maximizes throughput with 64 parallel threads.
Intel Core Ultra 9 275HX
Mobile Apex- ArchitectureArrow Lake-HX
- Cores24 (8P + 16E)
- Threads24 (No HT)
- LithographyTSMC 3nm (Compute)
- Max Turbo5.4 GHz
Ryzen Threadripper 7970X
HEDT Titan- ArchitectureStorm Peak (Zen 4)
- Cores32 (Uniform)
- Threads64 (SMT Enabled)
- LithographyTSMC 5nm (Compute)
- Max Boost5.3 GHz
Computational Performance
Intel dominates in single-core responsiveness (Geekbench 6 Single), while AMD's massive thread count delivers a 30% lead in multi-core scalability.
Power Dynamics & Thermal Envelope
A comparison of efficiency-optimized mobile silicon vs raw power HEDT scalability.
Efficiency King
55W - 160W
Intel 275HX PL1/PL2 Range
Intel uses TSMC 3nm for the compute tile to achieve 50% power reduction vs previous gen at the same performance levels.
Throughput King
350W
AMD 7970X Default TDP
Connectivity & Expansion
| Feature | Intel 275HX | AMD 7970X |
|---|---|---|
| PCIe Lanes | 24 Total (Gen 5/4) | 88 Usable (Gen 5.0) |
| Max Memory | 256 GB DDR5-6400 | 1 TB DDR5-5200 ECC |
| Memory Channels | Dual Channel (2) | Quad Channel (4) |
| High Speed I/O | Thunderbolt 4 / 5 | USB 3.2 Gen 2 (Native) |
| AI Acceleration | 13 TOPS NPU | Raw AVX-512 Compute |
Which Path Should You Choose?
The choice depends on your workflow geometry. Select your primary task to see our expert recommendation.